SEMICONDUCTOR PACKAGE HAVING STRUCTURE USING HIGH VOLTAGE

SEMICONDUCTOR PACKAGE HAVING STRUCTURE USING HIGH VOLTAGE

PURPOSE: A semiconductor package having a structure using a high voltage is provided to increase a gap between external leads by forming bent parts at contact parts between the external leads and a housing. CONSTITUTION: A semiconductor package includes a lead frame pad, a plurality of inner leads,...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SON, JUN SEO, JUN, O SEOP, NAM, SI BAEK
Format: Patent
Sprache:eng ; kor
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PURPOSE: A semiconductor package having a structure using a high voltage is provided to increase a gap between external leads by forming bent parts at contact parts between the external leads and a housing. CONSTITUTION: A semiconductor package includes a lead frame pad, a plurality of inner leads, a housing(110), and a plurality of external leads. A semiconductor die is loaded on the lead frame pad. The inner leads are electrically connected to the lead frame pad. The housing is used for covering the inner leads. The external leads are extended from the inner leads to one side(112) of the housing. The outer leads include the first external lead(121), the second external lead(122), and third external lead(123). A plurality of bent parts(124,126) are formed at contact parts among the second and the third external leads and the housing.