SUBSTRATE PROCESSING APPARATUS CAPABLE OF CONTROLLING CONTAMINATION OF SUBSTRATE TRANSFER MODULE

PURPOSE: A substrate processing apparatus capable of controlling contamination of a substrate transfer module is provided to reduce an interval of recovery time in an initial operation and improve efficiency of etching equipment by installing gate valves in the upper, lower, and side surfaces of a cover attached to the outside of a substrate transfer chamber. CONSTITUTION: A plurality of substrates are received in a receptacle. A transfer chamber provides a space for transferring the substrates. A substrate transfer unit transfers the substrates in the receptacle to a substrate processing part for performing a predetermined process on the substrate, disposed in the substrate transfer chamber(514). A load port(518a,518b) supports the receptacle, disposed in the outside of the substrate transfer chamber. A cover has a gas circulation path that circulates the purge gas supplied to the substrate transfer chamber and re-supplies the circulated purge gas to the substrate transfer chamber, attached to the substrate transfer chamber in a way that the cover surrounds the outer surface of the substrate transfer chamber.