SEMICONDUCTOR DEVICE SUPPRESSING METAL BURRS ON LEADS AND MANUFACTURING METHOD THEREOF

PURPOSE: A semiconductor device and a manufacturing method thereof are provided to prevent metal burrs on a cut portion of leads by covering whole peripheries of each lead with resin. CONSTITUTION: A semiconductor device includes a semiconductor chip, a plurality of leads(5) arranged around the semiconductor chip, terminals(5a) connected to the plural leads respectively, a plurality of wires(6), and a resin sealing member(3). The wires connect the semiconductor chip and the plural leads electrically with each other. The resin sealing member seals the semiconductor chip, the plural leads, and the plural wires. The terminals connected respectively to the plural leads are exposed to the exterior from a back surface of the sealing member. Each end of the plural leads is exposed to the exterior from side faces of the resin sealing member and is covered throughout the whole peripheries thereof with resin which constitutes the resin sealing member.