A method for preparing amorphous NI-P electrical alloy plating layer with improved ductility
PURPOSE: A method for manufacturing an amorphous structured nickel-phosphorus alloy electroplating layer with improved ductility is provided to improve mechanical connecting property by proceeding plating as applying periodic-reverse pulse current to the cathode. CONSTITUTION: In a method for manufa...
Gespeichert in:
Hauptverfasser: | , |
---|---|
Format: | Patent |
Sprache: | eng ; kor |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Schreiben Sie den ersten Kommentar!