LASER CUTTER HAVING IMPROVED COOLING APPARATUS

PURPOSE: A laser cutter having an improved cooling device is provided to prevent quality of a substrate from being deteriorated due to dispersed particles by allowing the cooling device to be operated without using cooling fluid. CONSTITUTION: A laser cutter(10) includes a laser oscillator(11) and a...

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Bibliographische Detailangaben
Hauptverfasser:	KANG, YU MYEONG, JUNG, GON JIN, RYU, SANG GIL, NOH, CHEOL RAE
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PURPOSE: A laser cutter having an improved cooling device is provided to prevent quality of a substrate from being deteriorated due to dispersed particles by allowing the cooling device to be operated without using cooling fluid. CONSTITUTION: A laser cutter(10) includes a laser oscillator(11) and a cooling unit(20). The laser oscillator(11) radiates laser beam onto a substrate(1) to be cut. The cooling unit(20) is installed at a rear portion of the laser oscillator(11) in order to cool the substrate(1) making contact with a laser beam collecting surface. The cooling unit(20) includes a thermal-electric device(23) consisting of two mutually different semiconductors. The thermal-electric device(23) has a semi-cylindrical structure having a heat absorbing section(23c) and a heat emission section(23e) at inner and outer portions thereof. 본 발명은 냉각장치가 개선된 레이저 절단기에 관한 것으로서, 레이저빔을 절단될 기판의 상면으로 조사하는 레이저발진기; 및 상기 레이저발진기에 의해 가열된 기판의 레이저빔 집광면에 열전소자의 흡열부를 접촉시켜 상기 집광면을 냉각시키고 발열부에는 방열수단을 구비하는 냉각수단을 포함한다. 상술한 바와 같이 구성함에 따라 냉각유체 비산에 따른 절단작업 완료 후 행하는 세정 작업 과정을 없앰과 아울러 냉각 영역 및 냉각온도의 정확한 제어가 가능하여 절단성능을 향상시키는 이점이 있다.