Power semiconductor module having optimized DBC pattern and terminal structure

PURPOSE: A power semiconductor module with an optimized direct bonding copper(DBC) pattern and a terminal structure is provided to use copper as a raw material of a sub electrode terminal by shortening the length of the sub electrode terminal, and to improve an electrical characteristic by eliminati...

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Bibliographische Detailangaben
Hauptverfasser: LEE, GWANG BOK, JUN, GI YEONG, KIM, JI HWAN
Format: Patent
Sprache:eng ; kor
Schlagworte:
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