Power semiconductor module and method for assembling the same to heat sink

PURPOSE: A power semiconductor module is provided to eliminate the necessity of additional coupling units and coupling processes and reduce the area of the power semiconductor module by inserting a plastic case of the power semiconductor module into a recessed part of a heat sink so that the power semiconductor module is coupled to the heat sink. CONSTITUTION: The power semiconductor module(200) is surrounded by a case. The lower surface of the power semiconductor module is coupled to the heat sink(300). Protrusions are formed at both side surfaces of the lower portion of the case to be inserted into the recessed part formed at both side surfaces of the heat sink. The case is a plastic case(210) which is made of poly penylent sulfide(PPS) or poly butylene terephtalate(PBT). 본 발명의 전력용 반도체 모듈은, 케이스에 의해 둘러싸이며 하부면은 히트 싱크와 결합되는 전력용 반도체 모듈로서, 케이스의 하부 양 측면에 돌출부가 형성되어, 이 돌출부가 히트 싱크의 상부 양 측면에 형성된 함몰부에 삽입됨으로써 히트 싱크와 결합되는 것을 특징으로 한다.