3 Power semiconductor module that has three dimensional structure and a method of manufacturing thereof
PURPOSE: A power semiconductor module with 3-d structure and fabrication method thereof are provided to simplify the production process, make the product smaller and decrease the production cost. CONSTITUTION: A power semiconductor module consists of a main circuit part(230), a control circuit part(...
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| Format: | Patent |
| Sprache: | eng ; kor |
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| Zusammenfassung: | PURPOSE: A power semiconductor module with 3-d structure and fabrication method thereof are provided to simplify the production process, make the product smaller and decrease the production cost. CONSTITUTION: A power semiconductor module consists of a main circuit part(230), a control circuit part(220), a control circuit terminal(410), a control circuit terminal(440), bonding wires(250) and molding material(350). The main circuit part has a structure that a power semiconductor device(232) is attached on a main circuit lead frame part. The control circuit part has a structure that a control circuit is attached on a control circuit lead frame. The control circuit terminal is directly connected to control circuit device by the bonding wires. The main circuit terminal is placed on the opposite side of the control circuit terminal and electrically connected to the main circuit device.
본 발명은 주회로단자 리드프레임부(main circuit terminal leadframe part) 및 제어회로 리드프레임부(control circuit leadframe part)가 주회로 리드프레임부(main circuit leadframe part)에 대하여 벤딩되어 있는 구조의 전력 반도체 모듈 및 그 제조방법에 관한 것이다. 본 발명에 따른 전력 반도체 모듈은 주회로부, 주회로부와 수직인 일면에 배치된 제어회로부 및 제어회로단자, 상기 제어회로부 및 제어회로단자와 마주하도록 상기 주회로부와 수직인 다른면에 배치된 주회로단자, 본딩와이어 및 몰딩재를 구비한다. 본발명에 따르면, 낮은 무게, 작은 크기 및 저렴한 비용의 인공지능 전력 모듈의 실현이 가능하다. |
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