COATING APPARATUS USED FOR SEMICONDUCTOR FABRICATION

PURPOSE: A coating apparatus used for semiconductor fabrication is provided to increase productivity of a semiconductor device by reducing the exchange number of a bowl portion for preventing a stacking phenomenon of particles. CONSTITUTION: A chuck portion(200) supports and rotates a wafer(100). Th...

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Bibliographische Detailangaben
Hauptverfasser:	CHOI, DEOK GYU, EOM, HO SEONG
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PURPOSE: A coating apparatus used for semiconductor fabrication is provided to increase productivity of a semiconductor device by reducing the exchange number of a bowl portion for preventing a stacking phenomenon of particles. CONSTITUTION: A chuck portion(200) supports and rotates a wafer(100). The chuck portion is induced into a bowl portion(300). An injection portion is induced to an upper portion of the chuck portion(200). A drain hole(400) is formed at a bottom of the bowl portion(300) in order to drain photoresist. An isolation portion(600) is formed at the bottom of the bowl portion(300) in order to drain smoothly the photoresist. A drain path is formed on the bottom of the bowl portion(300). An inner cup portion(700) is installed in the inside of the bowl portion(300). An outer cup portion(800) is installed at an upper end of a sidewall of the bowl portion(300). An exhaust hole is installed at the bottom of the bowl portion(300). A cleaning injection portion(900) removes particles from a back face of the inner cup portion(700) or the bottom of the bowl portion(300) by injecting a cleaning solution.