METHOD FOR FABRICATING FLIP CHIP BONDING PAD

PURPOSE: A method for fabricating a flip chip bonding pad is provided to form a bonding pad loaded into a package by using a flip chip bonding method. CONSTITUTION: A power pad pattern(101) is formed on an insulating layer(100) of a semiconductor substrate. A protective layer(102) is formed on a who...

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Bibliographische Detailangaben
1. Verfasser:	SEO, HAN GI
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PURPOSE: A method for fabricating a flip chip bonding pad is provided to form a bonding pad loaded into a package by using a flip chip bonding method. CONSTITUTION: A power pad pattern(101) is formed on an insulating layer(100) of a semiconductor substrate. A protective layer(102) is formed on a whole surface of the semiconductor substrate. An opening portion is formed by patterning the protective layer(102). An interlayer dielectric(103) and a pad conductive layer are formed on the whole surface of the semiconductor substrate including the opening portion. The pad conductive layer is formed by cooper or aluminium. The interlayer dielectric(103) is formed by laminating Ta and TaN. A photoresist pattern is formed on the pad conductive layer. The protective layer(102) is exposed by the pad conductive layer and the interlayer dielectric(103), and a pad pattern(106) is formed on an upper portion of the opening portion. The photoresist pattern is removed.