CONTINUOUS HORIZONTAL PLATING LINE WITH ROLLER TYPE CATHODE
PURPOSE: A continuous horizontal plating line with roller type cathode is provided which comprises a plurality of plating cells and a plurality of horizontally installed moving rollers and cathode rollers, thereby performs plating in a horizontal method so as to improve plating rate of printing circ...
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Format: | Patent |
Sprache: | eng ; kor |
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Zusammenfassung: | PURPOSE: A continuous horizontal plating line with roller type cathode is provided which comprises a plurality of plating cells and a plurality of horizontally installed moving rollers and cathode rollers, thereby performs plating in a horizontal method so as to improve plating rate of printing circuit boards and quality of plating. CONSTITUTION: In a plating line continuously performing copper plating as horizontally moving printing circuit boards by cathode rollers(7), anode plates(2) and moving rollers(6), the continuous horizontal plating line with roller type cathode comprises a plurality of plating cells consisted of insoluble anode plates(2), copper sulfate inlets(3), a lower spray box(4) and an upper spray box(5), and moving rollers(6) and cathode rollers(7), wherein a copper sulfate solution that is contained in the lower and upper spray boxes(4,5) respectively runs out to the opposite side to the copper sulfate inlets(3) after the printing circuit boards pass, the printing circuit boards to be plated horizontally moved by the moving rollers(6) so that the printing circuit boards enter the inside of the plating cells cut off by the insoluble anode plates(2), wherein plating is carried out as the printing circuit boards passing between the insoluble anode plates(2), a plating solution in the plating cells runs out into the opposite side to the copper sulfate inlets(3) to be circulated during plating as the printing circuit boards are passing through the plating cells, and the printing circuit boards are moved to the following plating cells by the moving rollers(6) installed at the end parts of the plating cells. |
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