INTEGRATED CIRCUIT BONDING PAD AND MANUFACTURING METHOD THEREOF

PURPOSE: An integrated circuit bonding pad is provided to supply an enough current into the bonding pad by securing a contact surface over a defined size and to prevent a crack in an insulating body due to a physical stress by forming an island-type insulating structure. CONSTITUTION: An integrated...

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Bibliographische Detailangaben
Hauptverfasser:	YOO, JAE CHEOL, PARK, GWANG MYEON, JUNG, MU JIN, KIM, YEONG PIL, JUN, BYEONG GU, WANG, SEON JONG
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PURPOSE: An integrated circuit bonding pad is provided to supply an enough current into the bonding pad by securing a contact surface over a defined size and to prevent a crack in an insulating body due to a physical stress by forming an island-type insulating structure. CONSTITUTION: An integrated circuit bonding pad comprises a first insulating layer(2710), a lower interconnection(2740) formed on the first insulating layer(2710), a second insulating pattern(2745) having via holes formed on the lower interconnection(2740), conductive plugs(2750) filled into the via holes, a second interconnection(2760) formed on the second insulating pattern(2745) and the conductive plugs(2750), a metal bumper layer(2900) formed on the second interconnection(2760), built-in island-type insulating bodies(2905), and an upper bonding pad(2705), thereby restraining a crack due to a physical stress.