STRUCTURE OF MOLD DIE FOR FABRICATING SEMICONDUCTOR PACKAGE

PURPOSE: A mold die structure is provided to optimize a molding process and to easily control an alien substance by respectively controlling a path surface of an air vent according to various conditions, such as a package species, an EMC(Epoxy Molding Compound) characteristic, and a processing seque...

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Bibliographische Detailangaben
1. Verfasser:	LIM, CHUNG BIN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	PURPOSE: A mold die structure is provided to optimize a molding process and to easily control an alien substance by respectively controlling a path surface of an air vent according to various conditions, such as a package species, an EMC(Epoxy Molding Compound) characteristic, and a processing sequence. CONSTITUTION: A mold die(5) structure comprises a pot installed with a plunger for pressurizing an EMC, cavities filled with the EMC, and air vents(4) installed at ends of the cavities. The mold die(5) structure further includes position detecting sensors installed in order to detect the position of the plunger on the pot, and path variable air vent blocks(7) for controlling the path surface of the air vent(4) according to the detecting results of the position detecting sensors.