WAFER TRAY OF RAPID THERMAL PROCESSING EQUIPMENT

PURPOSE: A wafer tray of rapid thermal processing equipment is provided to make a wafer have a uniform distribution of resistivity through an annealing process, by stably fixing the wafer to be aligned with a hot liner and by uniformly maintaining the interval with the hot liner regarding the entire...

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Bibliographische Detailangaben
Hauptverfasser:	PARK, HUN SUN, CHO, SUN HYEONG
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PURPOSE: A wafer tray of rapid thermal processing equipment is provided to make a wafer have a uniform distribution of resistivity through an annealing process, by stably fixing the wafer to be aligned with a hot liner and by uniformly maintaining the interval with the hot liner regarding the entire surface of the wafer. CONSTITUTION: The wafer tray is used in the rapid thermal processing equipment. A penetration hole is formed inside a frame(2). At least three sheets(8) are formed, extending from the frame to the inside of the penetration hole. The hot liner(6) is supported by the sheets.