Stacked intelligent power module package and manufacturing method thereof

PURPOSE: An intelligent power module package of a stack structure is provided to effectively improve a heat characteristic of the intelligent power module package by easily controlling the thickness of an insulation layer composed of polyimide or epoxy, and to eliminate a defective product by previo...

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Bibliographische Detailangaben
Hauptverfasser:	LIM, EUL BIN, KIM, SEUNG JIN, CHOI, SEUNG YONG, KIM, BYEONG GON, JUN, GI YEONG, LIM, SEUNG WON, JUN, O SEOP
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PURPOSE: An intelligent power module package of a stack structure is provided to effectively improve a heat characteristic of the intelligent power module package by easily controlling the thickness of an insulation layer composed of polyimide or epoxy, and to eliminate a defective product by previously performing a test of an electrical characteristic before the intelligent power module packages are integrated. CONSTITUTION: A power unit includes a heat sink(107). A control unit having a stacked structure is installed in the power unit, fabricated separately from the power unit. The power unit and the control unit are separately fabricated until a wire bonding process is performed. 스택된 형태의 인텔리젠트 파워 모듈 패키지 및 그 제조방법에 관해 개시한다. 본 발명은 방열판을 포함하는 전력부와, 상기 전력부와는 별도로 제작되어 상기 전력부에 스택된 구조의 컨트롤부를 갖는 인텔리젠트 파워 모듈 패키지 및 그 제조방법을 제공한다. 상기 인텔리젠트 파워 모듈 패키지의 전력부와 컨트롤부는 와이어 본딩이 완료된 리드프레임 형태로 서로 스택하거나, 몰딩을 수행하고 트림잉/폼임 및 전기적 특성검사를 완료한 상태의 반도체 패키지 형태로 락킹수단을 이용하여 서로 스택할 수 있다.