APPARATUS FOR PROCESSING THIN PLATE

PURPOSE: An apparatus for processing a thin plate is provided to improve efficiency of a fabricating process by simplifying a structure of a transporting portion. CONSTITUTION: A rotary etching apparatus(1) is formed with a vessel, a rotating shaft(4), the first nozzle member, the second nozzle memb...

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Bibliographische Detailangaben
Hauptverfasser:	BANG, IN HO, KOO, GYO UK, AHN, DU GEUN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	PURPOSE: An apparatus for processing a thin plate is provided to improve efficiency of a fabricating process by simplifying a structure of a transporting portion. CONSTITUTION: A rotary etching apparatus(1) is formed with a vessel, a rotating shaft(4), the first nozzle member, the second nozzle member, and a support(5). The second nozzle portion is arranged on an upper portion of the second nozzle portion. The vessel is formed with a vessel body(2) fixed to a frame(15) and a cover. The support(5) is used for fixing a semiconductor wafer. The rotating shaft(4) is a hollow shaft. The rotating shaft(4) is used for transferring a rotary power of a rotating shaft drive portion(26) to the support(5). The first nozzle portion is formed with a conduit for supplying treatment fluid(8) and the first nozzles(19). The support(5) has a multitude of holders(6).