APPARATUS FOR FABRICATING SEMICONDUCTOR

PURPOSE: An apparatus for fabricating a semiconductor is provided to improve process uniformity of a wafer and to prevent a vortex phenomenon occurring in the corner of the bottom of a bath, by making a uniform quantity of deionized water sprayed to wafers held in a wafer boat at a constant pressure. CONSTITUTION: The wafer boat is placed in the bath(110), and clean/etch liquid is contained in the bath. A supply unit(120) for supplying the clean/etch liquid to the inside of the bath is installed in the bath. An H-typed distribution pipe(122) is installed in a lower portion of the bath in a lengthwise direction of the wafer boat. A plurality of spray holes(128) are formed in the H-typed distribution pipe. A vortex prevention block(130) is installed in the corner of the bottom of the bath. The supply unit includes the H-typed distribution pipe and the vortex prevention block.