PCB AND MANUFACTURING METHOD THEREOF

PURPOSE: A PCB and a manufacturing method thereof are provided to prevent moisture from being penetrated through both ends of a via hole exposed through top and bottom surfaces of a board. CONSTITUTION: A board(100) has a top surface(62) and a bottom surface(64). A copper wiring layer(70) has a top...

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Bibliographische Detailangaben
1. Verfasser:	SIM, JONG BO
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PURPOSE: A PCB and a manufacturing method thereof are provided to prevent moisture from being penetrated through both ends of a via hole exposed through top and bottom surfaces of a board. CONSTITUTION: A board(100) has a top surface(62) and a bottom surface(64). A copper wiring layer(70) has a top wiring layer(71) formed on the top surface(62), and a bottom wiring layer(73) formed on the bottom surface(64). A via hole(80) is formed to pass through perpendicularly to the board(100), and electrically connect the top and bottom surfaces(70,73). A moisture proof metal layer(85) covers one end of the via hole exposed in the top surface. Solder resist layers(90) are respectively formed on the top and bottom surfaces of the board.