DIODE MODULE PACKAGE

PURPOSE: A diode module package is provided to emit easily heat generated from a silicon chip by changing a structure of an inner junction portion. CONSTITUTION: An epoxy(210) and a copper foil(220) are arranged on a heat sink(200). A copper spreader(231), a silicon chip(240), an alloy 42 spreader(2...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	LEE, GEUN HYEOK, JUN, GI YEONG, LEE, GWANG BOK, LEE, EUN HO
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PURPOSE: A diode module package is provided to emit easily heat generated from a silicon chip by changing a structure of an inner junction portion. CONSTITUTION: An epoxy(210) and a copper foil(220) are arranged on a heat sink(200). A copper spreader(231), a silicon chip(240), an alloy 42 spreader(232), and a clip(250) are arranged on the copper foil(220). The first solder(261) is arranged between the cooper foil(220) and the cooper spreader(231). The second solder(262) is arranged between the cooper spreader(231) and the silicon chip(240). The third solder(263) is arranged between the silicon chip(240) and the alloy 42 spreader(232). The fourth solder(264) is arranged between the alloy 42 spreader(232) and the clip(250). The thickness of the cooper spreader(231) is increased as much as 30 percents of the thickness of the first molybdenum spreader of an existing molybdenum spreader. The thickness of the alloy 42 spreader(232) is 1/2 of the second molybdenum spreader of the existing molybdenum spreader.