APPARATUS AND METHOD FOR SEARCHING STRAY CHILD THROUGH COMMUNICATION NETWORK

The present invention provides a process sequence and related hardware for filling a hole with copper. The sequence comprises first forming a reliable barrier layer in the hole to prevent diffusion of the copper into the dielectric layer through which the hole is formed. One sequence comprises formi...

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Bibliographische Detailangaben
Hauptverfasser: PARK, JEONG HO, JIN, HYEOK SU, KIM, HYEONG GEUN, HONG, GYEONG PO, NOH, JU YEONG, EOM, MI HYEON
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The present invention provides a process sequence and related hardware for filling a hole with copper. The sequence comprises first forming a reliable barrier layer in the hole to prevent diffusion of the copper into the dielectric layer through which the hole is formed. One sequence comprises forming a generally conformal barrier layer over a patterned dielectric, etching the bottom of the hole, depositing a second barrier, and then filling the hole with copper. An alternative sequence comprises depositing a first barrier layer over a blanket dielectric layer, forming a hole through both the barrier layer and the dielectric layer, depositing a generally conformal second barrier layer in the hole, removing the barrier layer from the bottom of the hole, and selectively filling the hole with copper.