METHOD AND STRUCTURE OF COLUMN INTERCONNECT

PURPOSE: A method and structure of column interconnection are provided to improve adhesive strength between the last metal layer and a dielectric adjacent to it. CONSTITUTION: A semiconductor chip includes a last metallic layer(LD,11) and a second last metallic layer(LM-1,13), a conductive via(12) c...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	BERGMAN-REUTER BETTE L, FEENEY PAUL M, PREVITI-KELLY ROSEMARY A, STAMPER ANTHONY K, ELLIS-MONAGHAN JOHN J, GEFFKEN ROBERT M, LANDIS HOWARD S, RUTTEN MATTHEW J, YANKEE SALLY J
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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