Semiconductor package comprising device with double density integration circuit

PURPOSE: A semiconductor package with a double density integration circuit is provided to minimize a height of a package without laminating semiconductor chips. CONSTITUTION: The first connection portion(132) such as a bonding pad is formed on the first active face(130). The second connection portio...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	JUNG, TAE GYEONG, SON, MIN YEONG
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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