METHOD FOR FORMING CAPACITOR OF SEMICONDUCTOR DEVICE
PURPOSE: A method for forming a capacitor of a semiconductor device is provided to simplify a manufacturing process by performing the manufacturing process without using an additional etching barrier. CONSTITUTION: A lower insulating layer(31) having a contact plug(33) is formed on an upper portion...
Gespeichert in:
Hauptverfasser: | , |
---|---|
Format: | Patent |
Sprache: | eng ; kor |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | PURPOSE: A method for forming a capacitor of a semiconductor device is provided to simplify a manufacturing process by performing the manufacturing process without using an additional etching barrier. CONSTITUTION: A lower insulating layer(31) having a contact plug(33) is formed on an upper portion of a semiconductor substrate. A carbon layer(35) is formed on the semiconductor substrate. The carbon layer(35) is patterned by performing a photo etching process. A conductive layer for storage electrode is formed on a whole face of the structure. The carbon layer(35) is removed by etching the conductive layer for storage electrode on the carbon layer(35). A hemispheral silicon is formed on the conductive layer for storage electrode in order to form a storage electrode. |
---|