APPARATUS FOR COMBINING ALIGNMENT MODULE WITH MANUAL TRAY MODULE AS ONE-BODY FOR SEMICONDUCTOR WAFER

PURPOSE: An apparatus for combining alignment module with manual tray module as one-body for semiconductor wafer is provided to reduce an operating time of a robot arm by forming a manual tray module and an alignment module with one body. CONSTITUTION: A housing(10) has a box shape. A spindle drivin...

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Bibliographische Detailangaben
Hauptverfasser:	HUH, MU YONG, HAN, DONG YEONG, BONG, TAE GEUN, PARK, BEOM UK, KIM, YEONG SEON
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS SEMICONDUCTOR DEVICES TESTING
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Beschreibung
Zusammenfassung:	PURPOSE: An apparatus for combining alignment module with manual tray module as one-body for semiconductor wafer is provided to reduce an operating time of a robot arm by forming a manual tray module and an alignment module with one body. CONSTITUTION: A housing(10) has a box shape. A spindle driving portion is mounted in the housing(10). A spindle(22) fixes a semiconductor wafer. The spindle driving portion moves and rotates the spindle(22) in order to align the semiconductor wafer. A camera(30) is installed on the housing(10) to photograph an identifier and a chip pattern of the semiconductor wafer. A guide rail(40) is installed at both sides of an upper portion of the housing(10). A manual tray(50) is installed on the guide rail(40) in order to load the semiconductor wafer. A cylinder provides a transferring power to the manual tray(50).