MULTIPLE-WAVELENGTH OPTICAL DETECTOR ARRAY AND MANUFACTURING
PURPOSE: A multi-wavelength optical detector array and manufacturing method are provided to detect several wavelength at same wafer by making a single chip integration a multi-wavelength detector using selective MOCVD crystal growing method. CONSTITUTION: A n-InP substrate(22) and a n-InP buffer lay...
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creator | NAM, EUN SU LEE, JUNG GI JANG, DONG HUN |
description | PURPOSE: A multi-wavelength optical detector array and manufacturing method are provided to detect several wavelength at same wafer by making a single chip integration a multi-wavelength detector using selective MOCVD crystal growing method. CONSTITUTION: A n-InP substrate(22) and a n-InP buffer layer(23) and an absorption layer(25) to absorb a several wavelength and p-InP layer(26) is laminated in turn. The absorption layer(25) absorbs the several wavelength. A semi-insulated InP sequestering layer(24) isolates the p-InP layer(26) by wavelength absorbed. The n-InP buffer layer(23) is formed on the n-InP substrate(22). The absorption layer(25) to absorb several wavelength is grown on the n-InP buffer layer(23). The p-InP layer(26) is grown on the absorption layer(25). The semi-insulated InP sequestering layer(24) is grown after etching from the p-InP layer(26) to the n-InP buffer layer(23), and then the absorption layer(25) and the p-InP layer(26) is isolated by wavelength. The non-reflective layer(27) and electrode(21,28) is formed at the result of above stage. |
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CONSTITUTION: A n-InP substrate(22) and a n-InP buffer layer(23) and an absorption layer(25) to absorb a several wavelength and p-InP layer(26) is laminated in turn. The absorption layer(25) absorbs the several wavelength. A semi-insulated InP sequestering layer(24) isolates the p-InP layer(26) by wavelength absorbed. The n-InP buffer layer(23) is formed on the n-InP substrate(22). The absorption layer(25) to absorb several wavelength is grown on the n-InP buffer layer(23). The p-InP layer(26) is grown on the absorption layer(25). The semi-insulated InP sequestering layer(24) is grown after etching from the p-InP layer(26) to the n-InP buffer layer(23), and then the absorption layer(25) and the p-InP layer(26) is isolated by wavelength. 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CONSTITUTION: A n-InP substrate(22) and a n-InP buffer layer(23) and an absorption layer(25) to absorb a several wavelength and p-InP layer(26) is laminated in turn. The absorption layer(25) absorbs the several wavelength. A semi-insulated InP sequestering layer(24) isolates the p-InP layer(26) by wavelength absorbed. The n-InP buffer layer(23) is formed on the n-InP substrate(22). The absorption layer(25) to absorb several wavelength is grown on the n-InP buffer layer(23). The p-InP layer(26) is grown on the absorption layer(25). The semi-insulated InP sequestering layer(24) is grown after etching from the p-InP layer(26) to the n-InP buffer layer(23), and then the absorption layer(25) and the p-InP layer(26) is isolated by wavelength. The non-reflective layer(27) and electrode(21,28) is formed at the result of above stage.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>DEVICES USING STIMULATED EMISSION</subject><subject>ELECTRICITY</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2001</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLDxDfUJ8QzwcdUNdwxz9XH1cw_xUPAPCPF0dvRRcHENcXUO8Q9ScAwKcoxUcPRzUfB19At1c3QOCQ3y9HPnYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXx3kFGBgaGBgamFkZG5o7GxKkCANJbKq8</recordid><startdate>20010705</startdate><enddate>20010705</enddate><creator>NAM, EUN SU</creator><creator>LEE, JUNG GI</creator><creator>JANG, DONG HUN</creator><scope>EVB</scope></search><sort><creationdate>20010705</creationdate><title>MULTIPLE-WAVELENGTH OPTICAL DETECTOR ARRAY AND MANUFACTURING</title><author>NAM, EUN SU ; LEE, JUNG GI ; JANG, DONG HUN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20010058227A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2001</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>DEVICES USING STIMULATED EMISSION</topic><topic>ELECTRICITY</topic><toplevel>online_resources</toplevel><creatorcontrib>NAM, EUN SU</creatorcontrib><creatorcontrib>LEE, JUNG GI</creatorcontrib><creatorcontrib>JANG, DONG HUN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NAM, EUN SU</au><au>LEE, JUNG GI</au><au>JANG, DONG HUN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>MULTIPLE-WAVELENGTH OPTICAL DETECTOR ARRAY AND MANUFACTURING</title><date>2001-07-05</date><risdate>2001</risdate><abstract>PURPOSE: A multi-wavelength optical detector array and manufacturing method are provided to detect several wavelength at same wafer by making a single chip integration a multi-wavelength detector using selective MOCVD crystal growing method. CONSTITUTION: A n-InP substrate(22) and a n-InP buffer layer(23) and an absorption layer(25) to absorb a several wavelength and p-InP layer(26) is laminated in turn. The absorption layer(25) absorbs the several wavelength. A semi-insulated InP sequestering layer(24) isolates the p-InP layer(26) by wavelength absorbed. The n-InP buffer layer(23) is formed on the n-InP substrate(22). The absorption layer(25) to absorb several wavelength is grown on the n-InP buffer layer(23). The p-InP layer(26) is grown on the absorption layer(25). The semi-insulated InP sequestering layer(24) is grown after etching from the p-InP layer(26) to the n-InP buffer layer(23), and then the absorption layer(25) and the p-InP layer(26) is isolated by wavelength. The non-reflective layer(27) and electrode(21,28) is formed at the result of above stage.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS DEVICES USING STIMULATED EMISSION ELECTRICITY |
title | MULTIPLE-WAVELENGTH OPTICAL DETECTOR ARRAY AND MANUFACTURING |
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