WIRE-BONDED CHIP SCALE PACKAGE

PURPOSE: A wire-bonded chip scale package is provided to improve yield of a reliability test after the chip scale package having center-pad type bonding pads is manufactured, by preventing a wire bonding defect and stress concentrated on solder balls. CONSTITUTION: A semiconductor chip(110) has a plurality of center-pad type bonding pads(112). A window(122) corresponding to the bonding pads is located in the center of a flexible board(120) which is adhered to an upper surface of the semiconductor chip by intervening adhesive. A metal interconnection(140) includes wire bonding parts(142) formed along both sides of the window and ball pads(144) connected to the wire bonding parts, formed on the flexible board. Bonding wires connect the bonding pads with the wire bonding parts. A pair of dams(162) are higher than the bonding wire, formed on the flexible board between the wire bonding parts and the ball pads. Molding resin(160) encapsulates an electrical connection part between the pair of dams. Solder balls(170) are formed on the ball pads. Stiffeners(180) of a metal material are formed in a lower portion of the flexible board along both sides of the window, corresponding to a region including the wire bonding parts.