PRINTED CIRCUIT BOARD WITH DAM FOR PREVENTING ADHESIVE FROM OVERFLOWING AND FINE PITCH BALL GRID ARRAY USING THE SAME

PURPOSE: A printed circuit board with a dam for preventing adhesive from overflowing is provided to maintain bonding reliability between a bonding wire and a substrate pad in a wire bonding process and to prevent an electrical short between adjacent substrate pads, by forming a dam between the substrate pad and a chip mounting region. CONSTITUTION: A substrate body includes an upper surface and a lower surface. The upper surface has a chip mounting region(117) in which a semiconductor chip is to be mounted. An external terminal for connection is formed on the lower surface opposite to the upper surface. A circuit trace pattern is formed on the upper and lower surfaces. An upper trace pattern is formed outside the chip mounting region, and includes a substrate pad(114a) electrically connected to the semiconductor chip to be adhered to the chip mounting region. A lower trace pattern is formed on the lower surface, and is electrically connected to the upper trace pattern. The external terminal for connection is connected to the lower trace pattern. A dam(170) of a predetermined height is formed between the chip mounting region and the substrate pad, so that adhesive for adhering the semiconductor chip in the chip mounting region is prevented from overflowing and contaminating the substrate pad.