APPARATUS FOR BENDING LEAD
PURPOSE: An apparatus for bending a lead is provided to improve a polishing characteristic of a mold, by scattering load applied to a cam punch over a plurality of axes when a lead is bent by a link operation of a connecting link and a punching link. CONSTITUTION: An upper mold(70) has a fixing unit...
Gespeichert in:
Hauptverfasser: | , |
---|---|
Format: | Patent |
Sprache: | eng ; kor |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | PURPOSE: An apparatus for bending a lead is provided to improve a polishing characteristic of a mold, by scattering load applied to a cam punch over a plurality of axes when a lead is bent by a link operation of a connecting link and a punching link. CONSTITUTION: An upper mold(70) has a fixing unit(76), a knock-out(71), a guiding unit(79) and a cam punch(73). The knock-out is elastically coupled to the fixing unit, and fixes an outer lead part of a package body(91) including the package body mounted on a lower mold(60) while engaging with the mold. The guiding unit is extended to both sides of the knock-out, having regular intervals. The cam punch is installed between the guiding unit on both sides of the knock-out so as to bend the outer lead part of the package body engaging with the lower mold and the knock-out. A connecting link(83) is connected to the guiding part by a fixed axis. A punching link(85) has a shape bent by a right angle and the bent portion is connected to a connecting axis in a lower portion of the connecting link. One end of the punching link faces toward the lower molding, and the other end is fixed in the knock-out by a cam axis(81). A connecting axis part carries out a link operation when the guiding unit descends while the knock-out and the lower mold engage to elastically fix the package body and the lead part by descent of the upper mold. |
---|