ELECTROPLATING METHOD FOR PROVIDING HARDNESS VARIATION OF MOLD COPPER PLATE FOR CONTINUOUS CASTING

PURPOSE: An electroplating method for providing hardness variation of a mold copper plate for continuous casting is provided not only to extend a life cycle of a mold copper plate but also to prevent a coating layer from being fallen off due to heat deflection by varying the coating layer in the dir...

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Bibliographische Detailangaben
Hauptverfasser:	NAM, SU HUI, LEE, BAEK HUI, KIM, SEON BOK
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:	PURPOSE: An electroplating method for providing hardness variation of a mold copper plate for continuous casting is provided not only to extend a life cycle of a mold copper plate but also to prevent a coating layer from being fallen off due to heat deflection by varying the coating layer in the directions of upper and lower sides of casting as well as in the width direction of casting. CONSTITUTION: A plating is carried out by varying a distance between a cathode and an anode which are installed in an electroplating vessel so that a hardness change of 200 to 650 Hv can be occurred in the directions of center and edge parts of a lower portion of a coating layer which is formed on a mold copper plate in order to improve a life cycle of the mold copper plate for continuous casting.