BALL GRID ARRAY PACKAGE

PURPOSE: A ball grid array(BGA) package is provided to prevent stress from being concentrated on a corner of a semiconductor chip and to maintain a good adhesion with molding resin filled by the semiconductor chip and an under-filling, by making the corner portion of the chip rounded. CONSTITUTION: A ball grid array(BGA) package(100) comprises a semiconductor chip(60), a substrate(70), an external connection terminal and molding resin(80). In the semiconductor chip, a plurality of electrode pads(62) are formed on an active surface, and respective metal bumps(64) are formed on the electrode pads. The metal bumps of the semiconductor chip are flip-chip bonded to an upper surface of the substrate. The external connection terminal electrically connected to the semiconductor chip is formed on a lower surface corresponding to the upper surface of the substrate. The molding resin charged by an under-filling protects the bump portion flip-chip bonded to a side of the surface. A corner portion(68) of the semiconductor chips is rounded to prevent stress from being concentrated on a corner portion of the semiconductor chip.