PRINTED CIRCUIT BOARD AND METHOD OF MAKING THE SAME

PURPOSE: A method of making a printed circuit board is provided to be capable of rapidly forming a via hole by processing an insulation layer by use of CO2 laser. CONSTITUTION: A method of making a printed circuit board comprises forming circuits(103a) at both sides by etching copper foils of both sides of a copper foil stack plate(101a). The first and second adhesion layers(101b,101c) are formed by depositing an insulation material on both sides of the copper foil stack plate(101a). A copper foil is adhered on a resultant structure. Circuits(103c,103d) are formed by applying an agent to the copper foil. At forming the circuit(103c,103d), the first to third open regions(121a,122a,128a) are formed by removing regions where via holes for the first and second adhesion layers(101b,101c) are to be formed. The first and second adhesion layers(101b,101c) are processed by irradiating CO2 layer to the first and second open regions(121a,122a), respectively.