SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

PURPOSE: A method for manufacturing a semiconductor package is provided to form an ultra thin semiconductor package, by forming a penetration hole of a constant width on a circuit board, and by forming a semiconductor chip in the penetration hole. CONSTITUTION: A circuit board(10) contains a plurali...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SHIN, WON SEON, LEE, SEON GU, LEE, SAN HO, JEON, DO SEONG
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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