SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

PURPOSE: A method for manufacturing a semiconductor package is provided to form an ultra thin semiconductor package, by forming a penetration hole of a constant width on a circuit board, and by forming a semiconductor chip in the penetration hole. CONSTITUTION: A circuit board(10) contains a plurality of bond fingers(12), ball lands(15), and a penetration hole(18) in the center. A semiconductor chip(2) having a plurality of input/output pads(4) on a side is positioned in the penetration hole of the circuit board. The input/output pads(4) of the semiconductor chip(2) are electrically connected to the bond fingers(12) of the circuit board(10). The semiconductor chip(2), a connection unit and a predetermined region of the circuit board(10) are encapsulated with an encapsulation material. A conductive ball is melted and bonded to the ball land of the circuit substrate to form input/output terminals.