SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

PURPOSE: A method for manufacturing a semiconductor package is provided to form an ultra thin semiconductor package, by forming a penetration hole of a constant width on a circuit board, and by forming a semiconductor chip in the penetration hole. CONSTITUTION: A circuit board(10) contains a plurali...

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Hauptverfasser: SHIN, WON SEON, LEE, SEON GU, LEE, SAN HO, JEON, DO SEONG
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator SHIN, WON SEON
LEE, SEON GU
LEE, SAN HO
JEON, DO SEONG
description PURPOSE: A method for manufacturing a semiconductor package is provided to form an ultra thin semiconductor package, by forming a penetration hole of a constant width on a circuit board, and by forming a semiconductor chip in the penetration hole. CONSTITUTION: A circuit board(10) contains a plurality of bond fingers(12), ball lands(15), and a penetration hole(18) in the center. A semiconductor chip(2) having a plurality of input/output pads(4) on a side is positioned in the penetration hole of the circuit board. The input/output pads(4) of the semiconductor chip(2) are electrically connected to the bond fingers(12) of the circuit board(10). The semiconductor chip(2), a connection unit and a predetermined region of the circuit board(10) are encapsulated with an encapsulation material. A conductive ball is melted and bonded to the ball land of the circuit substrate to form input/output terminals.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
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