PARALLEL RESISTOR-CAPACITOR COMPOSITE CHIP AND METHOD OF MAKING THE SAME

PURPOSE: A method of making a parallel resistor-capacitor composite chip is provided to be easy to adjust a resistance value by stacking a resistance component and a capacitor layer at the same time so as to form a single chip. CONSTITUTION: A method of making a parallel resistor-capacitor composite...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: PARK, IN GIL, EOM, U SIK, KIM, DEOK HUI
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PURPOSE: A method of making a parallel resistor-capacitor composite chip is provided to be easy to adjust a resistance value by stacking a resistance component and a capacitor layer at the same time so as to form a single chip. CONSTITUTION: A method of making a parallel resistor-capacitor composite chip comprises forming a slurry by use of a raw powder for a capacitor device. The slurry is fabricated into a green sheet(201) in a doctor blade method. A resistor component layer(202) is formed to print a resistance paste on the green sheet so that both ends of a resistance internal electrode layer(203) are connected to an external electrode. A capacitor layer is formed by printing Ag, Ag-Pd or Ni paste(205) on a ceramic sheet(204). After stacking the fabricated capacitor and resistor layers by a desired number, an annealing and pressing process is performed so that the stacked layers are closed attached. An external electrode is formed at an outer surface of the stacked structure so as to be connected with an internal electrode of the stacked structure.