BASE SUBSTRATE AND CHIP CARD BY USING THE BASE SUBSTRATE

BASE SUBSTRATE AND CHIP CARD BY USING THE BASE SUBSTRATE

PURPOSE: A base substrate and a chip card by using the base substrate are provided to reduce the manufacturing cost of the chip card by manufacturing the chip card using an apparatus used in chip on board package manufacturing process. CONSTITUTION: A base substrate for a chip card comprises a body...

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Hauptverfasser: AHN, MIN CHEOL, LIM, MIN BIN, OH, SANG EON, PARK, SANG YEONG
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator AHN, MIN CHEOL
LIM, MIN BIN
OH, SANG EON
PARK, SANG YEONG
description PURPOSE: A base substrate and a chip card by using the base substrate are provided to reduce the manufacturing cost of the chip card by manufacturing the chip card using an apparatus used in chip on board package manufacturing process. CONSTITUTION: A base substrate for a chip card comprises a body having an upper surface on which a semiconductor chip is attached and a lower surface(54) opposite to the upper surface. A wiring pattern(64) including a substrate pad(64a) connected to an electrode pad of the semiconductor chip is formed at both sides of the body. A plurality of connection terminals are arranged at one side of the lower surface. A circuit pattern including voltage terminals is formed on the lower surface. A via hole which passes through the substrate body is formed.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title BASE SUBSTRATE AND CHIP CARD BY USING THE BASE SUBSTRATE
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