BASE SUBSTRATE AND CHIP CARD BY USING THE BASE SUBSTRATE

PURPOSE: A base substrate and a chip card by using the base substrate are provided to reduce the manufacturing cost of the chip card by manufacturing the chip card using an apparatus used in chip on board package manufacturing process. CONSTITUTION: A base substrate for a chip card comprises a body...

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Bibliographische Detailangaben
Hauptverfasser:	AHN, MIN CHEOL, LIM, MIN BIN, OH, SANG EON, PARK, SANG YEONG
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	PURPOSE: A base substrate and a chip card by using the base substrate are provided to reduce the manufacturing cost of the chip card by manufacturing the chip card using an apparatus used in chip on board package manufacturing process. CONSTITUTION: A base substrate for a chip card comprises a body having an upper surface on which a semiconductor chip is attached and a lower surface(54) opposite to the upper surface. A wiring pattern(64) including a substrate pad(64a) connected to an electrode pad of the semiconductor chip is formed at both sides of the body. A plurality of connection terminals are arranged at one side of the lower surface. A circuit pattern including voltage terminals is formed on the lower surface. A via hole which passes through the substrate body is formed.