AUTOMATIC TEACHING COMPENSATION APPARATUS FOR SEMICONDUCTOR MAPPING MACHINE
PURPOSE: An apparatus is provided to increasing a mapping accuracy by matching mapping sensors placed at both sides of the apparatus automatically. CONSTITUTION: A mapping unit(20) detects a loading state of a wafer(W) after loading it to each cassette with a robot unit(10). For this operation, a la...
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Sprache: | eng |
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Zusammenfassung: | PURPOSE: An apparatus is provided to increasing a mapping accuracy by matching mapping sensors placed at both sides of the apparatus automatically. CONSTITUTION: A mapping unit(20) detects a loading state of a wafer(W) after loading it to each cassette with a robot unit(10). For this operation, a laser oscillator(21) radiates laser beam to a beam splitter(22). The mapping sensors(160) detecting the splitted beam adjust positions of the robot unit and mapping unit to perform a next mapping operation. If an abnormal mapping operation occurs, the mapping sensors of robot unit are reassembled. In that case, each photo sensor(162) recognizes a present position with reference parts(161) and provides a corresponding signal to a main board. The main board controls a step motor(130) placed under the mapping sensor to place the mapping sensors in the horizontal line so a correct position compensation is achieved as well as reducing the reassembling time. |
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