PLASTIC PACKAGE OF MODULE FOR OPTICAL COMMUNICATION
PURPOSE: A plastic package of a module for optical communication is provided to decrease a size of an optical module, by omitting a wire bonding process to simplify a manufacturing process, and by reducing the whole volume of the package. CONSTITUTION: A plastic package(50) of a module for optical c...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | PURPOSE: A plastic package of a module for optical communication is provided to decrease a size of an optical module, by omitting a wire bonding process to simplify a manufacturing process, and by reducing the whole volume of the package. CONSTITUTION: A plastic package(50) of a module for optical communication including a plastic body(55), a plate(58) and a port, comprises a metal electrode(74), holes(72), and a conductive material(75). The metal electrode is established in the plate, corresponding to an inner end part of a lead(56a) which is installed in the bottom portion of the plastic body(51) to a predetermined depth. The holes are formed in the bottom portion of the plastic body, corresponding to the inner end portion of the lead and the metal electrode. The conductive material is filled into the holes by electrically connecting the metal electrode and the inner end portion of the lead. |
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