APPARATUS FOR CUTTING SUBSTRATE AND LIQUID CRYSTAL DISPLAY PANEL USING LASER BEAM

PURPOSE: A cutting apparatus using laser beam is provided to cut a glass substrate having a wire on a cutting-plane line or a liquid crystal display panel by using laser beam. CONSTITUTION: A substrate selected from a first and a second substrates(30,32) has an outer surface(32b) having a cutting-pl...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KIM, BYUNG IL, LEE, U SIK, JEONG, SEONG UK, CHU, DAE HO, KIM, BEOM SU
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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