LASER CUTTING EQUIPMENT AND METHOD FOR CORRECTING CUTTING PATH THEREOF

PURPOSE: A laser cutting equipment is provided to minimize a cutting defect by distinguishing if a laser beam for cutting is advanced in a straight line via a scribe line by installing an optical modulator in the laser cutting equipment to irradiate a laser beam for directing on the same line of the...

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Bibliographische Detailangaben
Hauptverfasser: KIM, BYUNG IL, LEE, U SIK, JEONG, SEONG UK, CHU, DAE HO, KIM, BEOM SU
Format: Patent
Sprache:eng ; kor
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Zusammenfassung:PURPOSE: A laser cutting equipment is provided to minimize a cutting defect by distinguishing if a laser beam for cutting is advanced in a straight line via a scribe line by installing an optical modulator in the laser cutting equipment to irradiate a laser beam for directing on the same line of the laser beam for cutting. CONSTITUTION: A crack is generated in a glass base plate by rapidly heating with a laser beam for cutting and rapidly cooling. A laser beam for aligning is irradiated into the crack, an optical amount of laser beam for aligning reflected in a protruded face of crack is detected by a detecting portion and an electrical signal is transferred to a CPU. The CPU compares the electric signal with a previously inputted strength of light by exchanging the signal to a strength of light and decides if the laser beam for cutting is seceded from a scribe line. If the previously inputted strength of light is different from the strength of dispersed light, an angle swerved the laser beam for cutting is measured and a position of transferring device is controlled as the measured angle. After transferring the transferring device, the CPU exchanges the amount of light continuously transferred from the detecting portion into the strength of light and decides if the laser beam for cutting is aligned with the scribe line by comparing the exchanged strength of light and the previously inputted strength of light. If the scribe line and the laser beam for cutting is conformed, the glass base plate is cut. 커팅용 레이저 빔의 파장을 가시광선 대역의 파장으로 변조하여 지시용 레이저 빔을 발생시키는 광 변조 장치를 레이저 커팅 설비에 추가로 설치하여 지시용 레이저 빔이 커팅용 레이저 빔과 동일선상에서 커팅용 레이저 빔을 뒤따라가게 한다. 또한, 얼라인용 레이저 빔이 출력되는 얼라인 장치를 레이저 커팅 설비에 추가로 설치하여 커팅용 레이저 빔이 스크라이브 라인에 대하여 소정 각도만큼 틀어질 경우 스크라이브 라인과 커팅용 레이저 빔이 틀어진 각도를 측정하여 스크라이브 라인과 커팅용 레이저 빔을 자동적으로 얼라인시켜 준다. 그러므로, 지시용 레이저 빔을 통해 커팅용 레이저 빔이 스크라이브 라인을 따라 일직선으로 진행되는 지를 작업자가 육안으로 확인할 수 있어 지속적으로 커팅 불량으로 인해 제품의 수율이 저하되는 것을 방지할 수 있고, 설비 가동시간을 증가시킬 수 있어 제품의 생산성이 향상될 수 있는 효과가 있다.