HOLE PLUGGING LAND PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

PURPOSE: A hole plugging land printed circuit board capable of reducing a component mounting area and a noise of a signal by embedding a resin in a via and forming a pad and via areas as a single area and a manufacturing method thereof are provided. CONSTITUTION: In hole plugging land printed circui...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	CHO, HYUN GWI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PURPOSE: A hole plugging land printed circuit board capable of reducing a component mounting area and a noise of a signal by embedding a resin in a via and forming a pad and via areas as a single area and a manufacturing method thereof are provided. CONSTITUTION: In hole plugging land printed circuit board for connecting circuit patterns to each other using a via(23), a resin is embedded in the via(23) which is formed in a board. Pad metals are formed at upper and lower portions of via(23). The pad metals are connected to a contact metal(24) through the via(23). The contact metal(24) connects signal lines between a circuit pattern which is formed at other layer of the board. The via(23) embedded by the resin(25) and a pad area for mounting components are formed at a same area.