SEMICONDUCTOR PACKAGE

PURPOSE: A semiconductor package is provided to secure solder ball lands at a lower surface and to prevent the replacement of a heat sink by increasing locking force for the printed circuit board of the heat sink. CONSTITUTION: A protrusion sill(31) is formed on the upper part of a heat sink(30) in a semiconductor package(100). The protrusion sill is contacted to the outer circumference of a through hole(17) in a printed circuit board(10) while wrapping the upper surface of the heat sink by a sealing material(20). Thus, the structure of the heat sink is locked in the printed circuit board. Therefore, the heat sink is not omitted to the lower part of the printed circuit board even if an interface exfoliation is generated among the heat sink, the printed circuit board, and a semiconductor chip(1) by a heat expansion and a heat shrinkage. Moreover, the protrusion sill is formed only at the upper part of the heat sink for securing a larger number of solder balls(40) by expanding the surface area of the printed circuit board. The heat of the semiconductor is radiated to a mother board to improve a heat radiation rate due to enabling to attach or contact the lower surface of the heat sink to the printed circuit board.