METHOD FOR PRODUCING MULTI-LAYERED TITANIUM-ALUMINIDE METAL COMPOUND BOARD

PURPOSE: A method for producing a multi-layered titanium-aluminize metal compound board which is densely structured without limiting a size. CONSTITUTION: A method is completed by the steps of: pre-hot rolling a titanium board and an aluminum board after layering by turns; canning the pre-hot rolled...

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Bibliographische Detailangaben
Hauptverfasser:	LEE, WON CHUL, O, JIN GEUN, KIM, NAK JUN, KO, HYANG JIN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL PERFORMING OPERATIONS PUNCHING METAL ROLLING OF METAL TRANSPORTING
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Beschreibung
Zusammenfassung:	PURPOSE: A method for producing a multi-layered titanium-aluminize metal compound board which is densely structured without limiting a size. CONSTITUTION: A method is completed by the steps of: pre-hot rolling a titanium board and an aluminum board after layering by turns; canning the pre-hot rolled result; hot rolling the canned result in the temperature of 700 to 1200°C.; and heating the hot rolled result. Therefore, a TiAl3-TiAl metal compound multi-layered board is produced by heat process after producing the dense titanium-aluminize board. The multi-layered board is continually produced without limiting a size so as to massively produce and to have a wide range of application. 본 발명은 다층의 티타늄-알루미나이드 금속간 화합물 판재의 제조방법에 관한 것으로서, 상기 제조방법은 티타늄 판재와 알루미늄 판재를 교대로 적층한 다음, 예비 열간압연하는 단계, 예비 열간압연된 결과물을 캔닝하는 단계, 캔닝된 결과물을 700 내지 1200℃에서 열간압연하는 단계 및 열간압연된 결과물을 열처리하는 단계를 포함한다. 본 발명에 따르면, TiAl/TiAl로 구성되어 있으며, 내부에 균열이 거의 없는 치밀화된 조직 상태를 갖는 티타늄-알루미나이드 금속간 화합물 다층 판재를 얻을수 있다. 또한, 이러한 다층 판재는 규격에 제한없이 연속적으로 제조할 수 있기 때문에 그 적용범위가 매우 넓고 대량생산이 가능하다.