Low Tan-delta resin composite

According to the present invention, the low-dielectric tangent resin composition comprises: a novolak epoxy resin; and a bismaleimide compound containing phosphorus, wherein the low-dielectric tangent resin composition has a dielectric tangent (Df) of 0.002-0.004 measured after curing the low-dielec...

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Bibliographische Detailangaben
Hauptverfasser:	HWANG JAE SUK, PAEK MI JEONG, LEE JI AE, JUNG WON HO, KANG SUNG YEON, LEE EUN YONG, LEE GUI HANG, HONG SEONG HO, JUNG YONG SU
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAININGELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN,SULFUR, SELENIUM OR TELLURIUM CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC CHEMISTRY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	According to the present invention, the low-dielectric tangent resin composition comprises: a novolak epoxy resin; and a bismaleimide compound containing phosphorus, wherein the low-dielectric tangent resin composition has a dielectric tangent (Df) of 0.002-0.004 measured after curing the low-dielectric resin composition. 본 발명에 따른 저유전정접 수지조성물은, 노볼락 에폭시 수지; 및 인을 함유하는 비스말레이미드 화합물;을 포함하며, 저유전정접 수지 조성물로서, 상기 저유전 수지 조성물을 경화시킨 후 측정한 유전정접(Df)이 0.002 내지 0.004 인 것을 특징으로 한다.