HIGH PRESSURE HEAT-TREATMENT APPARATUS

The present invention provides a high-pressure heat-treatment apparatus comprising: a first chamber formed to accommodate an object for heat treatment; a second chamber formed to heat the first chamber while surrounding the first chamber; a third chamber including a 3-1 chamber disposed to surround...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MIN BIN HONG, LIM KUNYOUNG
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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