Sub-pad for polishing pad polishing pad comprising the same and method of manufacturing the sub-pad for polishing pad

The present invention provides a sub-pad for a polishing pad, a polishing pad including the same, and a method of manufacturing the sub-pad for the polishing pad. As a sub-pad laminated on the lower part of a top-pad that contacts a wafer and performs polishing, is comprises a nanofiber non-woven pa...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	JEONG JI HUN, MIN BYUNG JU, KANG MIN WOO, EOM YOUN SICK, KIM SEUNG GEUN, KIM SAN HA, OH NAM GUE
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING
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Beschreibung
Zusammenfassung:	The present invention provides a sub-pad for a polishing pad, a polishing pad including the same, and a method of manufacturing the sub-pad for the polishing pad. As a sub-pad laminated on the lower part of a top-pad that contacts a wafer and performs polishing, is comprises a nanofiber non-woven pad. The nanofiber non-woven pad is formed so that the nanofiber density of the outer periphery is 1.2 to 5 times the nanofiber density of other parts inside the outer periphery. 본 발명은 웨이퍼와 접촉하여 연마를 수행하는 탑패드(Top-pad)의 하부에 적층되는 서브패드로서, 나노섬유 부직포 패드를 포함하며, 상기 나노섬유 부직포 패드는 외주부의 나노섬유 밀도가 외주부 안쪽의 다른 부분의 나노섬유 밀도보다 1.2 배 내지 5배로 형성된, 연마패드용 서브패드, 이를 포함하는 연마패드, 및 상기 연마패드용 서브패드의 제조방법을 제공한다.