ADHESIVE SHEETS FOR HEAT DISSIPATION

The present application relates to a heat dissipation adhesive sheet comprising: a heat dissipation layer; at least one or more metal thin film layers formed on a lower surface of the heat dissipation layer; and an adhesive layer formed on a lower surface of the metal thin film layer. The heat dissi...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	YOUK SOO KYUNG, YU MIN SOOK, KWON HOE JUN, SONG JIN HO, CHOI SANG IL, LEE SANG HUN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS COMPOUNDS THEREOF DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INORGANIC CHEMISTRY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL NON-METALLIC ELEMENTS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The present application relates to a heat dissipation adhesive sheet comprising: a heat dissipation layer; at least one or more metal thin film layers formed on a lower surface of the heat dissipation layer; and an adhesive layer formed on a lower surface of the metal thin film layer. The heat dissipation adhesive sheet of the present application, by enabling to be easily cut into various sizes and attached closely even on a substrate with an out-of-plane curve, has an effect of simply and conveniently cooling a substrate part requiring heat dissipation. 본 출원은 방열층; 상기 방열층의 하면에 형성된 적어도 하나 이상의 금속 박막층; 상기 금속 박막층의 하면에 형성된 접착제층;을 포함하는 방열 접착시트에 관한것이다. 본 출원의 방열 접착시트는 평면 외 굴곡이 있는 기재에도 다양한 크기로 손쉽게 재단하여 밀착하여 부착함으로써 간편하고 편리하게 방열이 요구되는 기재부위를 냉각할 수 있는 효과가 있다.