DEVICE FOR PERFORATING CAERAMIC SUBSTRATE OF SEMICONDUCTOR

The present invention relates to a device for perforating a ceramic substrate for a semiconductor, which comprises: a main body housing which includes a connecting housing which extends in a height direction, a lower housing which extends in one end of the connecting housing positioned on a bottom s...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KIM, GEUN SU, JO, IL SU
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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