Cu-Ni-Si-Mn-Sn based Copper alloy material with excellent strength electrical conductivity and bendability and method for preparing the same

The present invention relates to a Cu-Ni-Si-Mn-Sn-based copper alloy material with excellent strength, electrical conductivity and bendability and a preparation method thereof. The Cu-Ni-Si-Mn-Sn-based copper alloy material of the present invention comprises 3.2 to 4.5 wt% of nickel (Ni), 0.7 to 1.2...

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Bibliographische Detailangaben

Hauptverfasser:	PARK CHEOL MIN, MUN SUN YOUNG, NAM HYO MOON, KIM JUN HYUNG
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ALLOYS CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS CHEMISTRY FERROUS OR NON-FERROUS ALLOYS GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUSMETALS OR ALLOYS MAKING METAL MALLEABLE BY DECARBURISATION, TEMPERING OR OTHERTREATMENTS METALLURGY METALLURGY OF IRON MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS TREATMENT OF ALLOYS OR NON-FERROUS METALS
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